| Constitutive modeling of strain-induced crystallization in filled rubbers R Dargazany, VN Khiêm, EA Poshtan, M Itskov Physical Review E 89 (2), 022604, 2014 | 65 | 2014 |
| A multi-physics constitutive model to predict hydrolytic aging in quasi-static behaviour of thin cross-linked polymers A Bahrololoumi, V Morovati, EA Poshtan, R Dargazany International Journal of Plasticity 130, 102676, 2020 | 57 | 2020 |
| Understanding decay functions and their contribution in modeling of thermal-induced aging of cross-linked polymers H Mohammadi, V Morovati, E Poshtan, R Dargazany Polymer degradation and stability 175, 109108, 2020 | 43 | 2020 |
| Constitutive modeling of elastomers during photo-and thermo-oxidative aging H Mohammadi, V Morovati, AE Korayem, E Poshtan, R Dargazany Polymer Degradation and Stability 191, 109663, 2021 | 35 | 2021 |
| Influence of differing material properties in media and adventitia on arterial adaptation—application to aneurysm formation and rupture H Schmid, A Grytsan, E Poshtan, PN Watton, M Itskov Computer methods in biomechanics and biomedical engineering 16 (1), 33-53, 2013 | 31 | 2013 |
| An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages EA Poshtan, S Rzepka, C Silber, B Wunderle Microelectronics Reliability 62, 18-25, 2016 | 13 | 2016 |
| An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions EA Poshtan, S Rzepka, B Michel, C Silber, B Wunderle 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 8 | 2014 |
| The Effects of Rate-dependent Material Properties and Geometrical Characteristics on Thermo-mechanical Behavior of TQFP Package EA Poshtan, S Rzepka, B Wunderle, C Silber, T von Bargen, B Michel Proceedings in Electronics Packaging Technology Conference (EPTC), 2012 IEEE …, 2012 | 5 | 2012 |
| Modeling of strain‐induced crystallization in natural rubbers EA Poshtan, R Dargazany, M Itskov PAMM 11 (1), 423-424, 2011 | 4 | 2011 |
| Accelerated determination of interfacial fracture toughness in microelectronic packages under cyclic loading EA Poshtan, S Rzepka, C Silber, B Wunderle 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1524-1530, 2015 | 2 | 2015 |
| An accelerated interfacial characterization method for microelectronic packages under automotive testing conditions-methodology and sample preparation EA Poshtan, C Silber, S Rzepka, B Michel, B Wunderle | 2 | 2014 |
| Resonance frequency dependency of Thermal Interface Materials (TIM) under vibration EA Poshtan, C Xingyuan, A Roessle 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 1 | 2018 |
| Mechanical behavior of thermal interface materials in electronic components under dynamic loading conditions EA Poshtan, S Hegde, A Roessle International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 1 | 2017 |
| Influence of strain induced crystallization on the mechanical behavior of natural rubbers EA Poshtan, R Dargazany, M Itskov Constitutive Models for Rubber VII, 215, 2011 | 1 | 2011 |
| A Hybrid Physics-Based, Data-Driven Approach to Model Damage Accumulation in Corrosion of Polymeric Adhesives R Dargazany, E Poshtan, H Mohammadi, W Mars, M Shaafaey, Y Chen Michigan State Univ., East Lansing, MI (United States), 2023 | | 2023 |
| Thermo-Mechanical behavior of Microelectronic Packages under cyclic loading conditions. BW Emad A. Poshtan, Christian Silber, Sven Rzepka Micromaterials and Nanomaterials for Automotives 15, 275-278, 2013 | | 2013 |
| Influence of Medial and Adventitial Layer on Arterial Adaptation H Schmid, EA Poshtan, J vanHaag, A Grytsan, M Itskov PAMM 10 (1), 89-90, 2010 | | 2010 |
| Design and experimental evaluation of micro embossing system EA Poshtan | | 2009 |
